Prolinx Labs Corporation

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6034427 Ball grid array structure and method for packaging an integrated circuit chipExpiredJan 28, 98Mar 07, 00[H01L]
5987744 Method for supporting one or more electronic componentsExpiredJul 01, 97Nov 23, 99[H01K]
5962815 Antifuse interconnect between two conducting layers of a printed circuit boardExpiredJan 18, 95Oct 05, 99[H01R]
5917229 Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnectExpiredJul 29, 96Jun 29, 99[H01L]
5906042 Method and structure to interconnect traces of two conductive layers in a printed circuit boardExpiredOct 04, 95May 25, 99[H01K]
5906043 Programmable/reprogrammable structure using fuses and antifusesExpiredJun 30, 97May 25, 99[H01K]
5872338 Multilayer board having insulating isolation ringsExpiredApr 10, 96Feb 16, 99[H05K]
5834824 Use of conductive particles in a nonconductive body as an integrated circuit antifuseExpiredMar 14, 95Nov 10, 98[H01L]
5813881 Programmable cable and cable adapter using fuses and antifusesExpiredOct 07, 94Sep 29, 98[H01R]
5808351 Programmable/reprogramable structure using fuses and antifusesExpiredOct 07, 94Sep 15, 98[H01L]
5767575 Ball grid array structure and method for packaging an integrated circuit chipExpiredOct 17, 95Jun 16, 98[H01L]
5726482 Device-under-test card for a burn-in boardExpiredOct 07, 94Mar 10, 98[H01L]
5572409 Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit boardExpiredOct 07, 94Nov 05, 96[H01R, H05K]
5537108 Method and structure for programming fusesExpiredOct 07, 94Jul 16, 96[H04Q]

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